Aegis delivers a full‑stack two‑phase liquid cooling system for high‑density AI and HPC workloads. Its patented 3D‑printed TurboPlate™ microchannel heat sink vaporizes coolant directly at the chip, providing up to 50 % lower thermal resistance in a compact, modular design that scales from edge racks to hyperscale data centers while using zero water and minimizing energy consumption.
Funding
Funding not disclosed
Founders
Product
Problem
Data centers and AI compute clusters generate extremely high heat densities, and traditional air or single-phase liquid cooling methods struggle to maintain optimal temperatures, leading to reduced performance, higher energy consumption, and limited scalability.
Solution
Aegis provides a full-stack, two-phase flow boiling liquid cooling system that directly vaporizes coolant at the chip surface, delivering rapid thermal response and high heat rejection in a compact form factor. Its patented 3D‑printed TurboPlate™ microchannel heat sink eliminates assembly steps and achieves up to 50 % lower thermal resistance compared with conventional machined plates. The modular Coolant Distribution Unit (CDU) integrates the heat sink with a closed‑loop dielectric fluid circuit, enabling scalable deployment from edge racks to hyperscale facilities. AI‑driven thermodynamic simulation and additive manufacturing accelerate design cycles to as little as seven days, while localized, tool‑free 3D printing reduces supply‑chain lead times and logistics costs. The solution operates with zero water usage, near‑zero material waste, and a projected pPUE of ≤ 1.05, supporting sustainable, high‑density AI workloads.
Target Audience
Primary customers are hyperscale data center operators, AI cloud service providers, and high‑performance computing facilities that require high‑density, energy‑efficient cooling for AI accelerators and GPU clusters.
Features
- Patented 3D‑printed microchannel TurboPlate™ heat sink with engineered nucleation cores for stable two‑phase flow boiling
- Closed‑loop dielectric coolant system delivering zero water usage and eliminating hazardous handling
- AI‑based thermodynamic simulation and Design‑for‑Additive‑Manufacturing workflow enabling 7‑day concept‑to‑print turnaround
- Modular Coolant Distribution Unit (CDU) for rapid scaling across edge, rack, and hyperscale deployments
- 50 % lower thermal resistance and up to 80 % material savings versus CNC‑machined plates
- Localized metal 3D printing eliminates tooling delays, reduces logistics, and supports on‑demand production
- Real‑time thermal responsiveness with lower junction temperatures and tighter delta‑T control
- Sustainable manufacturing footprint with near‑zero waste and reduced carbon emissions