Actions Semi designs and sells highly integrated low‑power System‑on‑Chip (SoC) solutions that combine audio processing, Bluetooth 5.x connectivity, power management, and on‑device AI compute (CPU/DSP/NPU) in a single package. These SoCs enable OEMs of wireless audio, wearables, and AIoT products to reduce component count, lower power consumption, and accelerate time‑to‑market while delivering high‑fidelity sound and on‑device AI capabilities.
Funding
$80M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
+2Founders
Product
Problem
Designers of wireless audio, wearable, and AIoT devices need highly integrated, low‑power chips that combine high‑quality audio processing, low‑latency Bluetooth connectivity, and on‑device AI acceleration, but existing solutions are fragmented, power‑hungry, and require multiple components.
Solution
Actions Semi develops and sells highly integrated System‑on‑Chip (SoC) solutions that merge audio ADC/DAC, voice pre‑processing, audio codecs, Bluetooth RF/baseband, power management, and AI compute (CPU/DSP/NPU) into a single low‑power package. These SoCs deliver high‑fidelity, low‑latency wireless audio while supporting on‑device AI inference for tasks such as voice activation and sensor analytics. By providing a unified hardware platform and accompanying SDKs, the company enables OEMs to reduce bill‑of‑materials, simplify board design, and accelerate time‑to‑market for smart speakers, headphones, wearables, and other AIoT products.
Target Audience
Primary customers are OEM manufacturers of wireless audio products, smart wearables, and AI‑enabled IoT devices that require a compact, low‑power, high‑performance SoC solution.
Features
- Integrated high‑performance audio signal chain (ADC/DAC, pre‑processing, codec, post‑processing) for premium sound quality
- Low‑latency Bluetooth 5.x RF, baseband, and protocol stack optimized for wireless audio applications
- Heterogeneous AI compute architecture (CPU + DSP + NPU) for on‑device neural network inference
- Comprehensive power‑management unit delivering ultra‑low standby and active power consumption
- Full SDK and reference designs that streamline firmware development and product integration
- Scalable product families covering Bluetooth speakers, headphones, smart watches, AR glasses, and portable video/audio devices