Accelsius

About Accelsius

Accelsius specializes in direct-to-chip liquid cooling technology that utilizes a waterless, low-pressure dielectric refrigerant to efficiently manage thermal constraints in data centers. This solution enables the cooling of over 2200W per socket, resulting in 50% energy savings compared to traditional air cooling systems while enhancing the performance and longevity of computing hardware.

```xml <problem> Data centers face increasing thermal management challenges due to the rising power density of modern computing hardware, leading to higher energy consumption and potential performance bottlenecks. Traditional air cooling systems struggle to efficiently dissipate heat from high-wattage CPUs and GPUs, resulting in increased operational costs and reduced hardware lifespan. </problem> <solution> Accelsius provides direct-to-chip liquid cooling solutions designed to address the thermal constraints of high-density data centers. Their waterless, low-pressure dielectric refrigerant technology enables efficient heat removal, supporting cooling of over 2200W per socket. This approach results in significant energy savings compared to air cooling, allowing for more power to be allocated to compute resources. The system's design prioritizes uptime and ease of deployment, utilizing robust materials and redundant components to ensure reliability and minimize the need for specialized training. </solution> <features> - Direct-to-chip cooling platform enabling cooling of 2200W+ per socket - Waterless, low-pressure dielectric refrigerant with a Global Warming Potential (GWP) of less than 1 - Energy savings of up to 50% compared to traditional air cooling systems - Industry-leading thermal resistance of 0.020°C/W at 700W+ TDP (H100 GPU) - Redundant, hot-swappable power supplies, sensors, and pumps for enhanced resiliency - Leak detection sensors and mitigation protocols to prevent damage to IT equipment - North American-based operations for faster lead times and superior quality control </features> <target_audience> The primary target audience includes data centers, high-performance computing facilities, and enterprises seeking to improve cooling efficiency, reduce energy costs, and enhance the performance and longevity of their computing hardware. </target_audience> ```

What does Accelsius do?

Accelsius specializes in direct-to-chip liquid cooling technology that utilizes a waterless, low-pressure dielectric refrigerant to efficiently manage thermal constraints in data centers. This solution enables the cooling of over 2200W per socket, resulting in 50% energy savings compared to traditional air cooling systems while enhancing the performance and longevity of computing hardware.

Where is Accelsius located?

Accelsius is based in Austin, United States.

When was Accelsius founded?

Accelsius was founded in 2022.

How much funding has Accelsius raised?

Accelsius has raised 42070000.

Location
Austin, United States
Founded
2022
Funding
42070000
Employees
70 employees
Major Investors
Innventure

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Accelsius

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Executive Summary

Accelsius specializes in direct-to-chip liquid cooling technology that utilizes a waterless, low-pressure dielectric refrigerant to efficiently manage thermal constraints in data centers. This solution enables the cooling of over 2200W per socket, resulting in 50% energy savings compared to traditional air cooling systems while enhancing the performance and longevity of computing hardware.

accelsius.com2K+
cb
Crunchbase
Founded 2022Austin, United States

Funding

$

Estimated Funding

$20M+

Major Investors

Innventure

Team (50+)

No team information available.

Company Description

Problem

Data centers face increasing thermal management challenges due to the rising power density of modern computing hardware, leading to higher energy consumption and potential performance bottlenecks. Traditional air cooling systems struggle to efficiently dissipate heat from high-wattage CPUs and GPUs, resulting in increased operational costs and reduced hardware lifespan.

Solution

Accelsius provides direct-to-chip liquid cooling solutions designed to address the thermal constraints of high-density data centers. Their waterless, low-pressure dielectric refrigerant technology enables efficient heat removal, supporting cooling of over 2200W per socket. This approach results in significant energy savings compared to air cooling, allowing for more power to be allocated to compute resources. The system's design prioritizes uptime and ease of deployment, utilizing robust materials and redundant components to ensure reliability and minimize the need for specialized training.

Features

Direct-to-chip cooling platform enabling cooling of 2200W+ per socket

Waterless, low-pressure dielectric refrigerant with a Global Warming Potential (GWP) of less than 1

Energy savings of up to 50% compared to traditional air cooling systems

Industry-leading thermal resistance of 0.020°C/W at 700W+ TDP (H100 GPU)

Redundant, hot-swappable power supplies, sensors, and pumps for enhanced resiliency

Leak detection sensors and mitigation protocols to prevent damage to IT equipment

North American-based operations for faster lead times and superior quality control

Target Audience

The primary target audience includes data centers, high-performance computing facilities, and enterprises seeking to improve cooling efficiency, reduce energy costs, and enhance the performance and longevity of their computing hardware.

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