Accelsius specializes in direct-to-chip liquid cooling technology that utilizes a waterless, low-pressure dielectric refrigerant to efficiently manage thermal constraints in data centers. This solution enables the cooling of over 2200W per socket, resulting in 50% energy savings compared to traditional air cooling systems while enhancing the performance and longevity of computing hardware.
Funding
$42.1M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Founders
Product
Problem
Data centers face increasing thermal management challenges due to the rising power density of modern computing hardware, leading to higher energy consumption and potential performance bottlenecks. Traditional air cooling systems struggle to efficiently dissipate heat from high-wattage CPUs and GPUs, resulting in increased operational costs and reduced hardware lifespan.
Solution
Accelsius provides direct-to-chip liquid cooling solutions designed to address the thermal constraints of high-density data centers. Their waterless, low-pressure dielectric refrigerant technology enables efficient heat removal, supporting cooling of over 2200W per socket. This approach results in significant energy savings compared to air cooling, allowing for more power to be allocated to compute resources. The system's design prioritizes uptime and ease of deployment, utilizing robust materials and redundant components to ensure reliability and minimize the need for specialized training.
Target Audience
The primary target audience includes data centers, high-performance computing facilities, and enterprises seeking to improve cooling efficiency, reduce energy costs, and enhance the performance and longevity of their computing hardware.
Features
- Direct-to-chip cooling platform enabling cooling of 2200W+ per socket
- Waterless, low-pressure dielectric refrigerant with a Global Warming Potential (GWP) of less than 1
- Energy savings of up to 50% compared to traditional air cooling systems
- Industry-leading thermal resistance of 0.020°C/W at 700W+ TDP (H100 GPU)
- Redundant, hot-swappable power supplies, sensors, and pumps for enhanced resiliency
- Leak detection sensors and mitigation protocols to prevent damage to IT equipment
- North American-based operations for faster lead times and superior quality control