CEng
Acacia Inc
Acacia Inc provides coherent optical transceiver modules and client‑optics that combine purpose‑built DSP ASICs with silicon photonic integrated circuits in compact pluggable form factors (e.g., QSFP‑DD, OSFP, CFP2). These modules deliver 100 G to 1.2 T per‑lane speeds with lower power consumption and reduced size, enabling cloud providers, telecom carriers, and data‑center operators to interconnect AI clusters, metro, long‑haul, submarine and space networks more efficiently.
- Hardware
- Semiconductor
- Telecommunications
Updated 5 months ago
Funding
Raised to date
$20MRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.
Funding rounds are not available yet.
Founders
Product
Problem
Network operators and cloud providers require ever‑higher bandwidth, lower power consumption, and reduced form factor to interconnect data centers, AI training clusters, and carrier networks across short‑reach, metro, long‑haul, and submarine links. Existing optical solutions are often bulky, power‑hungry, and lack the integration needed for scalable, cost‑effective deployment.
Solution
Acacia delivers a portfolio of coherent optical transceiver modules and client‑optics components that combine purpose‑built digital signal processing ASICs with silicon photonic integrated circuits. By integrating DSP, silicon PIC, and advanced 3D siliconization into compact pluggable form factors (e.g., QSFP‑DD, OSFP, CFP2), the company provides high‑speed (100 G to 1.2 T) transport with reduced power and size. These modules support a range of applications—from AI scale‑across and data‑center interconnect to metro carrier, long‑haul, submarine, and space communications—enabling operators to extend bandwidth while simplifying network architecture and lowering total cost of ownership.
Target Audience
Primary customers are cloud service providers, telecom carriers, and large enterprise data‑center operators that need high‑capacity, low‑power optical interconnects for AI workloads, metro and long‑haul transport, and emerging space communication links.
Features
- Coherent DSP ASICs delivering market‑leading power efficiency for 100 G‑1.2 T per‑lane rates
- Silicon photonic integrated circuits (PICs) that provide ultra‑compact, low‑loss optical paths
- 3D siliconization packaging that reduces module size and improves thermal performance
- Wide range of pluggable form factors (QSFP‑DD, OSFP, CFP2, CFP, QSFP28) for seamless integration into existing infrastructure
- PAM4 DSP and optical engine components supporting 200 G per‑lane designs for short‑reach AI clusters
- Reduced power consumption and footprint compared to traditional coherent optics, enabling higher density deployments
- Compatibility with MSA standards and interoperability across carrier, data‑center, and submarine networks