Applied Angstrom Technology supplies atomic layer etching (ALE) equipment that removes material one atomic layer at a time, delivering sub‑nanometer precision with production‑scale throughput. The system integrates protective coating chemistries, high‑precision hardware, and AI‑driven digital‑twin software to predict and optimize etch outcomes in real time, improving yield for 3D logic, memory, silicon photonics, and quantum chip manufacturing.
Funding
Funding not disclosed
Founders
Product
Problem
Advanced semiconductor manufacturing for AI, photonics, and quantum chips requires etching processes that can control material removal with sub‑nanometer accuracy. Conventional etching tools lack the precision and repeatability needed for 3D logic, memory, and silicon photonics structures, leading to yield loss and limited device performance.
Solution
Applied Angstrom Technology provides atomic layer etching (ALE) equipment that delivers sub‑nanometer precision while maintaining throughput suitable for high‑volume production. The system combines proprietary protective coating chemistries, mechanical and electrical design, and AI‑assisted software to control etch depth layer by layer. Integrated digital‑twin technology models the process in real time, enabling predictive adjustments and higher yield. The solution supports the fabrication of advanced 3D logic, memory, silicon photonics, and emerging quantum devices, helping manufacturers meet the tight patterning tolerances demanded by modern AI hardware.
Target Audience
Primary customers are semiconductor manufacturers producing advanced AI, photonics, and quantum chips, including fabs that fabricate 3D logic and high‑performance memory devices.
Features
- Atomic layer etching tool that removes material one atomic layer at a time for sub‑nanometer control
- Advanced protective coating processes that prevent damage to underlying structures during etch cycles
- AI‑driven digital‑twin software that predicts etch outcomes and optimizes process parameters in real time
- High‑precision mechanical and electrical design to ensure repeatable performance across wafers
- Compatibility with 3D logic, high‑density memory, silicon photonics, and quantum device manufacturing
- Scalable throughput to meet the demands of large‑scale AI hardware production