Ai Kere Si Intelligent Equipment designs and manufactures high-precision die bonding equipment for advanced semiconductor packaging. Their solutions include multi-chip, chip-to-wafer hybrid, and System-in-Package (SiP) bonders, engineered to enhance throughput and accuracy in critical packaging steps.
Funding
Funding not disclosed
Founders
Product
Problem
The semiconductor industry requires highly precise and reliable equipment for advanced packaging processes, including die bonding. Existing solutions may not meet the stringent accuracy and throughput demands for emerging technologies like System-in-Package (SiP) and hybrid bonding.
Solution
Ai Kere Si Intelligent Equipment designs and manufactures high-precision die bonding equipment tailored for advanced semiconductor packaging. The company offers a range of solutions, including multi-chip die bonders, chip-to-wafer hybrid bonders, and flip-chip bonders, engineered to meet the rigorous demands of modern semiconductor manufacturing. These machines are developed to enhance throughput and accuracy in critical packaging steps, supporting the integration of complex functionalities into smaller form factors. By focusing on advanced motion control, vision systems, and process optimization, Ai Kere Si enables manufacturers to achieve higher yields and performance in their packaging operations.
Target Audience
The primary customers are semiconductor manufacturers and outsourced semiconductor assembly and test (OSAT) providers specializing in advanced packaging, including IC packaging, power devices, optoelectronics, and sensors.
Features
- **Multi-Chip Die Bonders (e.g., HX 3600A, HX 3800, HX 2100):** Designed for high-speed IC epoxy die bonding, featuring advanced BLT and Tilt control for consistent bonding force and reliability. Supports 12-inch wafer handling and stacked die capabilities.
- **Chip-to-Wafer (C2W) Hybrid Bonders (e.g., QX 8800):** Offers ultra-high precision bonding with capabilities down to 500nm, crucial for advanced packaging technologies.
- **SiP Module Die Bonders (e.g., ZX 2200):** Optimized for System-in-Package applications, providing high-precision placement of multiple chips and components with a high degree of modularity and flexibility. Features advanced vision systems for diverse chip materials and sizes.
- **Power Device Bonding Equipment (e.g., MX 2200, CB 3800 Line, MX 600, MX 1200):** Specialized for power semiconductor packaging, including SiC modules and clip bonding. Offers high bonding force capabilities (up to 300N), precise force control, and optimized thermal management for reliable power device assembly.
- **Integrated Vision Systems:** Utilizes CMOS cameras and RGB lighting for accurate chip and substrate recognition, accommodating various materials and surface characteristics.
- **SECS/GEM Compliance:** All equipment supports SECS/GEM protocols for seamless integration into factory automation and Manufacturing Execution Systems (MES).
- **Advanced Motion Control:** Employs high-efficiency, high-precision motion platforms and supports various motion control systems (e.g., EtherCAT) for precise die placement.
- **Process Flexibility:** Features adaptable bonding heads, multiple dispensing options (dispensing, flip, drawing, dipping), and adjustable worktables to accommodate diverse packaging requirements.