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Agate Sensors

Agate Sensors offers a CMOS‑native hyperspectral sensor that captures 400–950 nm light across hundreds of wavelengths with sub‑10 nm resolution, delivering real‑time spectral video without moving parts or external optics. The chip integrates edge‑intelligence for on‑device analysis and is programmable via firmware, enabling OEMs to embed low‑cost, high‑volume spectral imaging into wearables, smartphones, drones, and defense equipment.

Espoo, FinlandFounded 2024211K+ followers
Updated 4 months ago

Funding

$4.7M raised to dateRaised to date based on public sources. This may differ from the amount the company actually raised and is based only on what is publicly available on the internet.

Funding rounds are not available yet.

Founders

Founder details are not available yet.

Product

Problem

Current imaging sensors for wearables, smartphones, and defense platforms are bulky, rely on external optics, and lack on‑chip processing, limiting the ability to capture detailed spectral data in real time and at scale.

Solution

Agate Sensors provides an ultra‑miniaturized, CMOS‑native hyperspectral sensor that integrates lab‑grade spectral resolution with on‑chip edge intelligence. The sensor captures 400–950 nm light across hundreds of wavelengths with sub‑10 nm resolution, delivering real‑time spectral video without moving parts or external filters. Software‑defined, programmable sensing lets OEMs tailor spectral acquisition to specific use cases, while on‑chip algorithms perform instant analysis, eliminating the need for cloud processing. The solid‑state design is compatible with standard semiconductor manufacturing, enabling low‑cost, high‑volume integration into compact devices such as wearables, smartphones, drones, and tactical equipment. This combination unlocks new layers of insight for health monitoring, material identification, and situational awareness across industries.

Target Audience

Primary customers are OEMs and system integrators developing next‑generation wearables, mobile devices, and defense equipment that require compact, high‑precision spectral imaging capabilities.

Features

  • Patented broadband CMOS pixel array covering visible to near‑infrared (400–950 nm) on a standard silicon wafer
  • Sub‑10 nm spectral resolution achieved through on‑chip processing algorithms
  • Solid‑state architecture with no moving parts, filters, or gratings for durability and compactness
  • Real‑time hyperspectral video capture with both global and rolling shutter modes
  • Software‑defined, programmable sensing that can be reconfigured for different applications via firmware updates
  • Edge intelligence on the sensor chip provides secure, low‑latency analysis without reliance on external servers
  • Scalable, mass‑production‑ready design leveraging mainstream semiconductor fabrication for cost‑effective deployment
This profile is AI-generated and may contain inaccuracies.